用TEM观察了背面损伤硅片的微观结构,用金相显微镜观察了样品热氧化后背面的形态,探索了损伤片的吸杂机理
we observe the microstructures of the back of damaged silicon with TEM, observe the rear form of the sample by thermal oxidation with metallographic microscope, and then explore the mechanism of the damaged film.